ASI - HOTBAR Pulsed Heat HBR/HSC/ACF Bonding System

Pulsed heat bonding with force control

Item Number: 6595

 

    • Realtime temperature and force profile display on the LCD touch screen.
    • Titanium alloy thermode ensure uniform temperature distribution, fast
    • heating and longest service life.
    • Password protection for process and system parameters.
    • Level mechanism for components co-planarity adjustment.
    • English / Simplify Chinese / Traditional Chinese user interface display.


OPTIONS

    • Tape Feeding System (TFS1) for holding silicon or Polyimid (Kapton) tape.
    • Colour (CC19) alignment module for TAB/flex to PCB/LCD.
    • Thermal Profiling Unit (TPU1); additional thermocouples for temperature profile monitoring.

 

לפרטים נוספים והזמנות לחצו כאן
System Specifications
Dimensions 630 mm x 520 mm x 500 mm
Weight (without fixtures) 60 Kg
Power consumption 220V / 50Hz or 110V / 60Hz, 2KVA (Factory preset)
Air supply 4 to 6 Kg/cm²
Maximum fixture height 48 mm
Fixture assembly baseplate 150 mm x 150 mm ( 2 sets)
Starting operation method Two hand control
Turntable actuation Pneumatic (PBS213); Manual (PBS203)
Vacuum for components holding 2 sets; built-in
Password 6 digits (2-level)
Thermode Specifications
Force range 20 N to 500 N
Force accuracy ± 2 N
Actuation type Pneumatic
Thermode stroke 50 mm maximum
Thermode length 100 mm maximum
Pulsed Heat Control Specifications
Heating method Pulsed heating, high speed PID control
Temperature range preheat / heat 50 to 500 °C (1 degree increment)
Time period preheat / heat 1 to 60 seconds (1 second increment)
Temperature accuracy ± 2 °C
Programmable heat profile 3 programs, non-volatile
Thermocouple K type
Communication port RS-232C
Relevant Documents
PBS213_203_1.3_Eng_NoLogo

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