Aqueous-based stencil cleaner for removal of solder pastes and SMT adhesives
VIGON® SC 210, based on the MPC® Technology, is an aqueous-based cleaning agent specifically developed to clean SMT stencils. The cleaning agent reliably removes solder pastes and SMT adhesives in a single process and provides excellent cleaning results, even at low temperatures. VIGON® SC 210 is designed to be used in spray-in-air and ultrasonic cleaning systems.
Advantages compared to other surfactant cleaners:
- Consistently good cleaning results at temperatures between 18-40°C/64-104°F
- High bath loading capability providing extended bath life and reduced cleaning agent costs
- Aqueous-based, surfactant-free cleaner; leaves no residues on substrates or inside the equipment
- Excellent material compatibility
- No flash point and thus, can be used without explosion-proof protection
- Non-foaming when used in spray-in-air and ultrasonic systems