Aqueous-based stencil and PCB cleaner for the removal of solder pastes, SMT adhesives and fluxes
VIGON® SC 202, based on MPC® Technology (Micro Phase Cleaning), is an aqueous-based cleaning agent designed for the reliable removal of solder pastes and SMT adhesives from stencils. The product has also been developed to clean double-sided misprints, with one side already soldered. The cleaning agent is recommended to be used in spray-in-air and ultrasonic cleaning systems.
Advantages compared to other surfactant cleaners:
- Specifically developed for the removal of fluxes from doublesided misprinted boards with one side soldered
- Easily filtered and therefore provides an extended bath life and reduces cleaning agent costs
- Surfactant-free and can be easily rinsed residue-free
- No flash point and can be used in equipment without explosion proof protection
- The cleaner is applicable in spray-in-air systems and ultrasonic dip tanks
- No foaming when used in spray-in-air systems
- Halogen free
- Low odor