Advanced PCB Cleaning Solutions - A Professional Guide
PCB cleaning is a critical step in the manufacturing process that directly impacts product reliability, performance, and lifespan. Contaminants such as flux residues, dust, and microscopic particles can lead to electrical shorts, accelerated corrosion, and even functional failures. Using professional PCB cleaning solutions reduces the risk of defects, enhances product performance, and helps ensure compliance with the industry's most stringent quality standards.
Choosing the right cleaning solution is therefore an essential part of ensuring product quality.
Below are several recommended solutions based on innovative technologies and extensive industry experience:
VIGON® EFM - For Manual Cleaning Applications, Available in Bulk and Spray Formats
An advanced cleaning agent designed for the removal of resin-based flux residues in manual cleaning processes.
The product is halogen-free, dries quickly without leaving residues, and ensures compatibility with most materials used in the electronics industry. Click here for more information about VIGON® EFM.
ATRON® SP 200 - For Maintenance Cleaning of Flux Residues After Reflow Ovens
A water-based cleaning agent with excellent performance in removing hardened flux residues from soldering carriers and condensation traps after oven processes. Its extended service life reduces the frequency of cleaning bath replacement, helping lower operating costs and improve maintenance efficiency. Click for more information about ATRON® SP 200.
VIGON® SC 200 - For Automated Stencil Cleaning Processes
Based on Micro Phase Cleaning (MPC®) technology, VIGON® SC 200 is designed for SMT stencil cleaning at room temperature. It efficiently removes solder paste and adhesive residues while maintaining material compatibility and leaving no residues behind. Click for more information about VIGON® SC 200.
VIGON® A 201
This MPC®-based cleaning agent is specifically designed for removing flux residues from both leaded and lead-free no-clean solder pastes. It delivers bright, clean solder joints without the need for additional additives. The product provides outstanding cleaning performance in air spray processes, particularly in capillary gaps and underneath low-clearance components. Click for more information about VIGON® A 201.
VIGON® A 250 - Water-Based Cleaning Agent for Low- and Medium-Pressure Cleaning Processes
An advanced cleaning agent based on MPC® (Micro Phase Cleaning) technology, specifically developed for low- and medium-pressure air spray applications with extended exposure times. It is designed to remove a wide range of flux residues from electronic assemblies while providing exceptional protection for solder joints and all types of materials. Click for more information about VIGON® A 250.
VIGON® N 600 - Neutral pH Water-Based Cleaning Agent for Air Spray Processes
VIGON® N 600 is an advanced MPC®-based cleaning agent featuring a neutral pH formulation for use in automated inline and batch air spray cleaning systems. It effectively removes a broad range of flux residues while offering excellent compatibility with sensitive metals and polymers, ensuring thorough and safe cleaning of electronic assemblies. Click for more information about VIGON® N 600.
Important Considerations When Selecting a PCB Cleaning Solution:
- Residue Compatibility: Select a cleaning agent that is specifically suited to the type of residue being removed, such as flux, oils, or particulate contamination. Proper selection improves cleaning efficiency and reduces the risk of PCB defects.
- Material Compatibility: Ensure that the cleaning agent is compatible with the materials used in the assembly, including polymers, metals, and optical components.
- Environmental Responsibility: Water-based and halogen-free cleaning agents provide environmentally friendly solutions while maintaining a high level of cleaning performance.
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