A Technological Achievement for ASI
Every industrial production line, no matter how advanced or precise, eventually faces a technological challenge that requires a significant leap forward.
This was the case for A.L. Electronics, one of Israel’s most established and respected electronics manufacturers, which approached us with a clear objective: improve soldering quality and significantly reduce voids in its production process.
Until then, the company had been successfully operating a Rehm Vapor Phase Soldering System for more than 11 years. However, the system had originally been designed for small-batch production and could no longer meet the demands of their growing manufacturing line.
A.L. Electronics had already recognized the need to transition to vacuum reflow technology, and ASI was ready to provide the most suitable solution.
We led a comprehensive project that included process evaluation, engineering coordination, and installation of the Rehm VXP+ nitro VAC 734 Reflow Oven, one of the most advanced systems available worldwide. The selection of this model was based on its exceptionally uniform heat distribution, extremely low ∆T values, and highly precise digital process control capabilities.
The installation itself involved the integration of a sophisticated system, executed with precise coordination and planning.
Technology, Performance, and Advantages
The VXP+ nitro VAC 734 is an advanced Forced Convection Reflow Oven equipped with an integrated vacuum chamber. This solution combines high thermal efficiency with the ability to dramatically reduce voids in solder joints of critical components such as BGAs and Power Packages.
How Does the Technology Work?
The Vacuum Chamber (VAC Chamber) is positioned immediately after the peak temperature zone. Once the PCB reaches reflow temperature, it is transferred into a sealed chamber where a controlled vacuum process is applied. By reducing the pressure to approximately 50-150 mbar, gas bubbles trapped within the molten solder are released, significantly reducing void formation and substantially improving solder joint quality.
Process Control and Traceability: The ViCON system provides complete control over temperature profiles, conveyor speed, vacuum pressure, and statistical process parameters. Every event is automatically recorded and stored, ensuring full traceability and seamless integration with Industry 4.0 environments and MES systems.
Energy Efficiency and Sustainability: The oven is equipped with Rehm’s intelligent energy management system and a regenerative Heat Exchanger, enabling energy savings of up to 20%. In addition, the washable fume filters significantly reduce operating and maintenance costs.
Maintenance and Integration: The modular design allows easy access to all system components, while the intelligent maintenance system provides alerts for cleaning and replacement requirements. The oven integrates easily into existing SMT production lines and can be implemented with minimal disruption to manufacturing operations.
Within just a few days of installation, impressive results were achieved: soldering quality improved significantly, and void levels were substantially reduced.
The Partnership That Makes the Difference
Success stories like this do not happen by chance. They are the result of close collaboration, professional planning, and continuous support until measurable results are achieved on the production floor. At ASI, we are proud to contribute another milestone to Israel’s manufacturing industry and to serve as a trusted partner for real technological solutions, from engineering and implementation to ongoing service and support.
