ASI Technologies is a leading supplier of advanced systems, equipment, and materials for the Electronics Assembly Industry. We provide innovative and reliable solutions tailored to each customer's needs, with a strong commitment to professional service and uncompromising integrity.
For over 10 years, ASI has been supplying advanced coating systems from PVA, combining extensive industry experience with advanced technological expertise. We have compiled a selection of successful projects and customized solutions delivered to leading manufacturers across the industry. Discover our experience, professionalism, and the added value we bring to every project.
The Delta 8 is an advanced robotic system for Selective Coating and Dispensing applications, combining exceptional precision (repeatability up to 25 microns), enabling highly accurate processing with minimal masking requirements, together with maximum operational flexibility. The system is built on a robust three-axis motion platform, with an option to expand to four axes (valve tilt and rotation), and is suitable for both inline production lines and batch manufacturing environments.
System programming is performed quickly and easily באמצעות PathMaster®, a dedicated software platform that ensures accuracy and flexibility in path planning. Combined with an onboard computer providing unlimited program storage, the system adapts to a wide range of technical applications, including selective coating, precision dispensing, and customized solutions for electronics manufacturing, coatings, and industrial assembly processes.
PVA Applications
Conformal Coating
Application of a thin or thick protective coating to a Printed Circuit Board (PCB), either selectively on designated areas or across the entire assembly. Selective coatings are applied using a variety of advanced technologies, including atomized spray coating, airless spray coating, needle dispensing, and precision jetting technology.
Dispensing
PVA’s award-winning valves and pumps enable the application of a wide range of chemical materials while meeting the requirements of the most demanding applications.
Gasketing
Also known as Form-in-Place Gasketing (FIPG), this process involves dispensing one-component or two-component liquid materials that cure to form a seal resistant to liquids and gases. This automated process eliminates the need for pre-manufactured gaskets and allows easy adaptation to changing design requirements.
Surface Mount Adhesive / Solder Paste
The process of applying SMT adhesive or Solder Paste for mounting surface-mount components onto PCBs requires highly accurate deposition of adhesive dots or solder paste deposits. Precision is critical for a wide range of component types, especially as component sizes continue to shrink. This level of accuracy is achieved through advanced dispensing processes and AUGER pump technology.
Dam & Fill
A two-step process that begins with dispensing a highly viscous material around the perimeter of a component or electronic assembly, followed by dispensing a lower-viscosity material within the enclosed area to achieve complete coverage. The dam layer can be applied as a single bead or multiple layers depending on the required fill height.
Encapsulation & Glob Top
Application of epoxy- or silicone-based materials that completely cover a designated area around a Flip-Chip device or soldered component. This process provides mechanical stability against shock and vibration while protecting against moisture and environmental contaminants.
Potting
A process in which an enclosure containing electronic circuits is filled with a liquid compound that cures and encapsulates the entire assembly. Potting provides mechanical protection against shock and vibration, as well as environmental protection from moisture and foreign particles.
Thermal Interface Materials (TIM)
Thermal Interface Materials (TIMs) fill the microscopic gaps between mating surfaces with a material that provides significantly better thermal conductivity than air. TIMs act as a conductive bridge that improves heat transfer between heat-generating components, such as integrated circuits, and heat-dissipating components, such as heat sinks.
For consultation, additional information, or orders, please contact us or leave your details using the contact form, and our team will get back to you.
